Data compiled by Woofun AI shows that Samsung Electro-Mechanics has commenced mass production of packaging substrates for Qualcomm's inaugural data center AI accelerator at its Busan facility. This operational milestone signifies a strategic expansion of the partnership beyond traditional mobile and PC sectors into the high-growth data center market.

The production focuses on FC-BGA (Flip Chip Ball Grid Array) substrates for the 'AI200' accelerator, which debuted in October last year. Designed primarily for AI inference, the chip integrates Qualcomm's proprietary 'Oryon' CPU and 'Hexagon' NPU alongside low-power LPDDR5 memory to optimize energy efficiency. With Qualcomm targeting a full commercial launch in the second half of this year, Samsung Electro-Mechanics has accelerated substrate manufacturing to synchronize with the product rollout, underscoring a deepening collaboration in AI infrastructure supply chains.