Woofun AI reports that sources close to NVIDIA have clarified that the industry-wide mass production of Co-Packaged Optics (CPO) is not experiencing delays. The prevailing market confusion likely stems from conflating the distinct timelines of small-scale validation introductions with broader industry adoption phases.

Industry insiders identify the upstream Indium Phosphide laser chip as the critical bottleneck for CPO and high-speed optical communication products. The complexity of constructing optical chip production lines, combined with extended customer validation periods, has rendered this component the weakest link in current capacity expansion efforts. Consequently, while CPO remains the long-term solution for large-scale model training clusters, the immediate landscape will rely on Non-Pluggable Optics (NPO), Linear Pluggable Optics (LPO), traditional pluggable modules, or multi-channel parallel structures to address ultra-high bandwidth requirements. This dynamic suggests that high-speed optical interconnection technology will undergo a phased iteration process, prioritizing upstream capacity deployment amidst sustained computing power bandwidth competition.