Woofun AI reports that Applied Materials (AMAT) presented its AI-era memory and packaging roadmap at the June 25 DRAM and Advanced Packaging Technology Seminar. Deutsche Bank maintained a Buy rating, noting that AI servers are driving DRAM, HBM, and advanced packaging toward more complex manufacturing processes. AMAT’s DRAM market share has risen from under 15% in 2013 to the current global number one position. The company highlighted that AI memory upgrades involve systemic changes in transistors, interconnects, bonding, and metrology, creating demand for additional deposition, etch, clean, polish, bond, and metrology steps. In HBM packaging TSV processes, AMAT covers 15 of 19 material engineering steps, introducing new equipment such as the Avila 2 CVD, Nokota VMax 2, and OPTA Quad CMP to address warpage, void filling, and planarization challenges. Next-generation DRAM shifts include EUV patterning, 4F² vertical transistors, and 3D DRAM, requiring finer interconnects and logic-like stacking methods. For advanced packaging, AMAT is developing larger panel-level substrates (310×310mm to 600×600mm) to address density and cost pressures, utilizing digital lithography, expanded copper plating via the NEXX acquisition, and the Kinex Hybrid Bonding System for integrated die-to-wafer bonding. Process control relies on VeritySEM 7AP and SEMVision G7AP for critical dimension measurements and defect review. Deutsche Bank cited risks including cyclical memory customer capital expenditure, yield verification for new structures like 3D DRAM, and consistency challenges in panel-level packaging.