Woofun AI reports that ASE Technology Holding Co., Ltd. has adjusted its advanced packaging pricing upward by more than 20%, affecting services such as CoWoS and FoCoS for major American customers. The adjustment is attributed to rising raw material costs and significant increases in capital expenditure, which grew from $2 billion annually in previous years to $5.3 billion last year and $8.5 billion this year.

ASE Technology COO Wu Tianyu stated that the price hike reflects necessary cost adjustments rather than subjective market leverage. With Taiwan Semiconductor Manufacturing Co.'s CoWoS capacity remaining insufficient and outsourcing ratios increasing, ASE's workload in chip-on-substrate and wafer-level testing continues to expand, prompting other industry players to consider similar pricing strategies.