Woofun AI reports that Huawei semiconductor chief He Tingbo published the "Time Microscaling Theory for Multilevel Electronic Systems" (Taofu Law) V2 on ChinaXiv on July 3rd. The updated paper expands the theoretical framework into an eight-chapter system, incorporating engineering implementation details and physical schematics for core technologies including the τ-level spatiotemporal model, LogicFolding architecture, and Hi-ONE optical engine.

The V2 version elaborates on the LogicFolding "Gear Ratio" concept, explaining how hybrid bonding pitch alignment enables unit-level continuous optimization rather than macroblock-level discrete optimization. It also presents mass-produced measured data for Kirin 2026 and Kirin 9030 Pro, listing voltage, frequency, normalized power consumption, area, and power density to validate the time constant τ-based scaling theory.