Woofun AI reports that Micron Technology is executing a massive global capacity expansion to mitigate severe shortages in AI-driven HBM, DRAM, and NAND memory. The company anticipates tight supply conditions persisting until after 2026, with new facilities coming online from 2027 onwards.

In the United States, Micron’s Manassas facility achieved mass production of 1α nm technology in May 2026, supported by a $2 billion expansion for DDR4 wafers. A $50 billion investment in Boise will begin production in mid-2027, contributing to a total US commitment of approximately $200 billion including a second fab. The Clay, New York megafab project aims for large-scale production around 2030. In Asia, a ¥15 trillion ($93 billion) fab in Hiroshima, Japan, broke ground in early July for high-end AI chips, with shipments expected in 2028.

Additionally, a $24 billion NAND fab in Singapore targets production in late 2028, while the $1.8 billion acquisition of Rexchip in Taiwan plans DRAM production in 2027. Micron aims to produce 40% of its DRAM in the US by 2030.