Woofun AI reports that China's CXMT is currently testing a bonded DRAM trial production line in Hefei. This approach aims to produce high-performance memory without EUV lithography by bonding separate wafers for cell arrays and peripheral circuits using multi-patterned DUV. Korean media indicates assessments suggest CXMT may lead its Korean competitors, including Samsung and SK hynix, in both technology maturity and development velocity.