Woofun AI reports that Intel is evaluating a dual-side power delivery architecture for its 1.4nm ultrafine process to compete with TSMC and Samsung. While the initial 14A base process utilizes PowerDirect backside technology, the subsequent 14A2 iteration may employ simultaneous front and back power sourcing.

Intel aims for a 1.3x density increase on 14A versus 18A, with 14A2 potentially reducing M0 spacing to 21nm. The company will redistribute front-side metal wiring for auxiliary power and clock signals to address miniaturization constraints. Risk production for 14A is scheduled for 2028, with mass production following in 2029. Intel intends to release the 0.9 version process design kit in October and secure fabless orders within 18 months.

Meanwhile, TSMC plans true 1.4nm A14 shipments in 2028, and Samsung targets commercial backside power delivery in its 2nm enhanced SF2Z process by 2027.