Woofun AI reports that Samsung Electronics and SK Hynix are reassessing the timeline for adopting Hybrid Bonding technology in next-generation High Bandwidth Memory (HBM). Market expectations indicate a further delay in introduction as demand for thickness reduction and improved heat dissipation has declined. Both companies are developing alternative thermal solutions, including HPB and iHBM, planned for HBM5 products. Industry insiders maintain that Hybrid Bonding remains a critical long-term pathway as HBM I/O counts continue to rise.