Woofun AI reports that Apple and Broadcom have formalized a multi-year agreement valued at over $300 billion, extending their partnership through 2031. The pact covers the design and production of custom ASIC components and advanced wireless connectivity technologies for Apple devices. Under the terms, Broadcom will manufacture more than 15 billion chips in the United States and invest $1.5 billion to expand its Fort Collins, Colorado facility, which specializes in FBAR filters and RF components critical for iPhone and Mac wireless communication.

This collaboration represents the largest project within Apple's $600 billion four-year U.S. investment plan. The agreement expands beyond traditional RF components to include custom ASICs, aligning with reports of joint development on the "Baltra" AI server processor, scheduled for mass production via TSMC's N3P process in 2026. The deal provides Broadcom with long-term revenue stability as Apple accounts for approximately 20% of its annual sales.

Additionally, the partnership suggests Apple will delay its transition to in-house cellular modems until 2031.