Woofun AI reports that Meta plans to commence production of its "IRIS" AI chip in September, targeting a doubling of computing capacity to 14 gigawatts by 2027. Simultaneously, Micron Technology announced a strategic investment of up to $3 billion to reinforce the U.S. chip supply chain.

Samsung and SK Hynix are postponing the adoption of hybrid bonding packaging technology for next-generation HBM4, with industry expectations shifting toward application in 16-layer HBM4E chips. The valuation premium of the "Magnificent Seven" relative to the remaining S&P 500 constituents has dropped to 10%, a ten-year low.