Woofun AI reports that Tower Semiconductor announced a $3 billion investment plan for Japan on July 14, supported by a $1 billion subsidy from the Japanese government. The initiative aims to bolster local chip manufacturing capabilities.

The first phase involves retrofitting the former Fab 6 facility to produce 300mm silicon photonics devices and advanced packaging, with full production targeted for the fourth quarter of 2027. Simultaneously, the second phase will commence construction of a new 300mm lithography manufacturing plant adjacent to the Fab 7 facility.