Woofun AI reports that Samsung Electronics is refining its domestic investment strategy to construct four new semiconductor wafer fabrication plants by 2030. The proposed facilities include Pyeongtaek P5 and P6, one unit at the Yongin Namsa-eup cluster, and one in Gwangju.

Concurrently, SK Hynix intends to build Y1 and Y2 at the Yongin Wonsam-myeon cluster plus one additional fab in Gwangju. Together, the two firms aim to complete seven new wafer fabs between now and 2030. Both companies previously disclosed a combined equipment investment roadmap of 3.2 quadrillion Korean won, excluding AI data center costs. Samsung has accelerated its Yongin fab completion target from 2047 to 2040, while SK Hynix moved its timeline from 2045 to 2033. Industry insiders note that Samsung recently queried partners regarding additional local investment contingent on the Gwangju project, though feasibility remains uncertain due to current capacity and infrastructure constraints.