Woofun AI reports that Samsung Electronics has commenced construction of a Die-to-Wafer (D2W) hybrid bonding mass production line at its Pyeongtaek P5 plant, focusing on advanced packaging for next-generation HBM and logic semiconductors. The company intends to procure approximately 50 machines from Besi, priced at roughly $43 million each, though negotiations are delayed due to customization requests.

Concurrently, Samsung is evaluating domestic suppliers SEMES and Hanwha Semitech, which have already submitted samples for verification.

This technology replaces traditional thermocompression bonding with hybrid copper bonding to shorten interconnection lengths, enabling the vertical stacking of HBM DRAM layers onto logic dies for 3D system-level packages. Analysts indicate this process is slated for NVIDIA's next-generation AI accelerator, Feynman, which will utilize custom HBM. While initially targeted for HBM4E, the implementation timeline has shifted, with Samsung estimating large-scale application between 2029 and 2030.