Woofun AI reports that AMD and Samsung are nearing the conclusion of a major supply contract for HBM4 memory, with initial shipments projected for the latter part of the third quarter. AMD CEO Lisa Su confirmed that negotiations are in their final stages, building upon a memorandum of understanding signed earlier this year that prioritizes Samsung’s HBM4 supply for AMD’s next-generation AI accelerators and expands wafer foundry collaboration.

During the "AMD Advancing AI 2026" event, Su announced that the Helios AI server rack system has entered mass production and will begin shipping by the end of Q3. This production milestone has prompted further discussions to expand the specific HBM4 supply terms. Samsung executives Han Jin-man and Cho Sang-yeon engaged in talks with AMD CTO Joseph Macri, who described the ongoing relationship as "cooperative" without detailing specific future manufacturing arrangements.