Woofun AI reports that TSMC outlined aggressive expansion plans at its 2026 China Technology Forum, targeting a 70% compound annual growth rate in N2 and A16 process capacity between 2026 and 2028. The company also aims for an 80% CAGR in CoWoS and SoIC packaging capacity through 2027, while projecting the global semiconductor market to reach $1.5 trillion by 2030, driven primarily by high-performance computing and AI demand.