TrendForce reports that surging demand for AI semiconductors is catalyzing advancements in advanced packaging, positioning Fan-Out Panel-Level Packaging (FOPLP) as a key industry frontier. TSMC has standardized its CoWoS architecture to a 310 × 310 mm panel format, establishing 2026 as a critical validation window for equipment and material suppliers. The roadmap targets pilot production in 2027, with full-scale mass production slated for the second half of 2028.

Beyond CoWoS, TSMC is advancing research into glass core substrates as the next evolutionary step in packaging technology. While CoWoS moves toward commercialization, glass-based interposers remain in the developmental phase, with mass production anticipated only after 2030. This dual-track strategy underscores the semiconductor giant’s long-term commitment to sustaining performance gains in high-density AI computing infrastructure.