2027 DRAM and HBM Capacity Sold Out in Advance
Full-year 2027 DRAM and HBM supply is fully booked, with NAND allocations expected to close by month-end. This shortage restricts PC and smartphone access while sustaining high storage prices.
Woofun AI reports that full-year 2027 capacity for DRAM and HBM has been sold out in advance. While NAND flash supply remains less constrained, its 2027 allocation is projected to be fully booked by the end of this month.
Industry sources indicate that some firms avoid publicly confirming supply locks to prevent triggering further capacity competition. Manufacturers currently fulfill only 60% to 70% of initial requests, prioritizing cloud service providers and large AI companies. Consequently, DRAM availability for smartphone and PC makers is expected to decline significantly compared to 2026. Companies without finalized procurement volumes for next year may face severe acquisition difficulties. High storage prices are anticipated to persist, with 2027 price increases potentially moderating but supply gaps and cost pressures remaining difficult to alleviate in the short term.
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