Bullish

2027 DRAM and HBM Capacity Fully Allocated, Severe Storage Shortage Expected

2026-08-04 11:51

Major manufacturers have sold out 2027 DRAM/HBM capacity. Customers receive only 60-70% of demand, indicating a severe shortage phase ahead.

Woofun AI reports that SK Hynix, Micron (MU), and Samsung Electronics have fully allocated their 2027 DRAM and HBM production capacity. Current customer fulfillment rates stand at approximately 60% to 70% of initial requests. Serenity (citing Digitimes) indicates that supply constraints exceed market expectations, potentially leading to the most severe storage shortage phase in 2027.

Annual NAND capacity for Western Digital (SNDK), Samsung Electronics, and Micron is also fully booked. Kioxia and SK Hynix are expected to complete their capacity allocation by August 2026. While final product prices will be determined closer to delivery based on market conditions, the tight supply-demand relationship persists despite earlier predictions of a mid-2027 surplus. Continuous AI infrastructure development continues to drive demand for HBM and high-end DRAM.

WOOFUN AI

Impact Assessment · Quick Read

The complete allocation of 2027 DRAM and HBM capacity signals a structural supply deficit driven by AI infrastructure demand. With fulfillment rates below 70%, the market faces a severe shortage phase, contradicting previous surplus forecasts. This tightness may sustain elevated pricing power for major manufacturers and intensify competition for advanced memory chips among tech giants.
Generated by WOOFUN AI · For reference only, not investment advice

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