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Samsung and SK Hynix Test AMEC Etching Gear Amid US Export Risk

2026-08-05 11:16

Samsung and SK Hynix evaluate AMEC etching tools for China plants to hedge against US export bans. Tests started two years ago; no deployment decision made yet.

Woofun AI reports that Samsung Electronics and SK Hynix are evaluating etching equipment from China's AMEC for potential use in their Chinese manufacturing facilities, aiming to mitigate risks associated with tightening US export controls. The testing phase commenced approximately two years ago, though neither firm has committed to expanding deployment.

Sources indicate the companies view Chinese suppliers as a contingency for maintaining existing production lines, rather than for capacity expansion, fearing future restrictions could cover maintenance of Western gear. Samsung denied testing AMEC equipment, while SK Hynix declined to comment. In 2025, the U.S. revoked the "Validated End-User" status of the two companies' China factories, then issued annual licenses for their import of chip manufacturing equipment in 2026. Samsung Electronics operates a NAND factory in Xi'an, while SK Hynix operates NAND factories in Dalian and DRAM factories in Wuxi, with these production lines currently heavily reliant on etching equipment from U.

S. manufacturers such as Applied Materials and Lam Research. If AMEC's equipment is eventually certified by Samsung Electronics or SK Hynix, it would represent a significant commercial endorsement of Chinese semiconductor equipment manufacturers. TechInsights data shows that Chinese equipment prices are usually 20% to 30% lower than similar foreign products, but they still face obstacles such as longer certification periods, smaller service networks, intellectual property rights, and political pressure.

WOOFUN AI

Impact Assessment · Quick Read

This evaluation signals a strategic shift toward supply chain resilience amid escalating geopolitical tensions in the semiconductor sector. If certified, AMEC's equipment would gain significant commercial validation, potentially accelerating the localization of China's chip manufacturing ecosystem. However, hurdles such as longer certification timelines, IP concerns, and political pressure remain substantial barriers to widespread adoption.
Generated by WOOFUN AI · For reference only, not investment advice

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