Chinese DRAM 3D R&D Advances by 2027 with Domestic Equipment

Chinese DRAM makers target 3D progress by 2027 using local gear. Prices may match global leaders despite lower yields. Capacity expansion in Hefei, Shanghai, and Beijing to operate by 2028.

Woofun AI reports that Chinese DRAM manufacturers are expected to advance 3D DRAM product development by 2027. Industry insights indicate that despite potentially lower yield rates, Chinese suppliers could offer DRAM prices comparable to global leaders. Capacity expansion projects in Hefei, Shanghai, and Beijing are projected to reach full operation by 2028. Some wafer factories reportedly utilize primarily domestically produced Chinese equipment, excluding high-end tools such as lithography systems.